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Analysis
Test
Program
Packaging
Design
Customer
Technical Data
Package
Internal Design
Customer
Requirements
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
DAR090709
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SC100712 TMT Overview
Design Tools
2D Microwave - EEsof, Microwave Office
3D Microwave - Ansoft, HFSS
Photonic Design and Simulation
– Zemax – Far Field Optics
– RSoft – Near Field Optics
Pro Engineering, Pro Mechanica, COSMOS, SolidWorks
– 3D Mechanical Design
– FEA, Stress Analysis, Thermal Analysis,
Dynamic Analysis
Mentor Graphics MCM Station
– Schematic Capture
– Autorouting
– High Speed/Crosstalk Analysis
– Idea - Schematic Capture, Digital Simulation
– Quick Fault - Test Vector Generation
OrCad
– Schematic Capture
– Autorouting
AutoCAD
– Substrate layout
– Hybrid packaging design
– Microelectronic interconnection
PSPICE
– Design, Analysis and Simulation
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
DAR090709
15
SC100712 TMT Overview
Substrate Technologies
Laminates
– FR4
– Polyimide
– Rigid-Flex
– Insulated Metal
– Proprietary High Tg (BT, BN)
– PTFE (Teflon, Rogers™)
Thick Film
– Au/Ag on Al2O3, BeO, AlN
– Diffusion Patterning™, Fodel®, Etchable
– 2”x2” wafers standard (up to 6.5”)
– 0.002” lines/spaces
– Integral resistors and capacitors
– Hi-frequency process ≥ 20 (40) GHz
Thin Film
– Ti-W, Au, Ni, NiCr, TaN on Al2O3, BeO, AlN
– Thermal evaporation and sputter deposition
– 2”x2” wafers
– 0.001” (0.0006) lines/0.0005” spaces
– 50-200 ohms/sq.
LTCC
– Ferro
– DuPont
HTCC
DAR090709
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
16
SC100712 TMT Overview
Surface Mount Packaging
Market Focus
– Mixed Technology on a single circuit
• SMT, Chip-n-Wire, Flip-Chip BGA
– Multiple substrates
• Laminate, Rigid-Flex, Ceramic
– Low to mid-range volume
• up to 25K circuits per month
– High level of Traceability
• Trusted Source
– High Reliability
Up to 18” x 18” panels
Up to 8,000 modules per month
Simultaneous board placement of different
configurations
010-005 up to 55 mm2 component sizes
Fine pitch, down to 15 mil
Offline set up & programming
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
DAR090709
17
SC100712 TMT Overview
Mixed Signal/Mixed Assembly Technologies
Combined chip & wire and SMT assembly
High density substrates/laminates
– Thick/thin film microstrip, stripline, coplanar
– LTCC, FR4, PTFE, Rogers materials
– Multiple substrate construction
Automated SMT assembly
– Solder and epoxy dispense/screening
– High speed pick & place
• Siemens D1 (010-005 and larger)
• Mydata My12E (0201’s and larger)
– Solder reflow: 5 zone Vitronics system
– Aqueous cleaning
– Over 200,000 components per day/single shift
Advanced thermal/mechanical modeling analysis
and simulation
High speed functional, parametric and dynamic
testing
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
DAR090709
18
SC100712 TMT Overview
Manufacturing Technologies
Dispensing Die Attach Wire Bonding Flip Chip
Microelectronic Interconnection:
SMT Pick & Place Solder Reflow
SMT:
Cover Seal Encapsulation
Packaging:
Stenciling/
Screen Printing
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
DAR090709
19
SC100712 TMT Overview
Process Validation & Screening
Pressurizing
Helium Chamber
Wire Bond Pull
and Shear Tester
Fine Leak Test Gross Leak Test
Sonoscan Temp Cycling
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